Invention Grant
- Patent Title: Housing, method of manufacturing the same, electronic device including the same
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Application No.: US15603896Application Date: 2017-05-24
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Publication No.: US10448528B2Publication Date: 2019-10-15
- Inventor: Dong Hyeon Hwang , Sung Jin Park , Byoung Ju Ahn , Kwang Youn Lee , Young Jin Yi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2016-0065596 20160527
- Main IPC: H05K7/14
- IPC: H05K7/14 ; G06F1/16 ; H05K5/02 ; C23C16/44 ; H05K5/00 ; C25D11/12

Abstract:
A housing of an electronic device is provided. The housing includes a first surface, a second surface, a side surface surrounding at least a portion of a space formed between the first surface and the second surface, a first surface layer formed by applying a first texture and a first color to a first area of at least one of the first surface, the second surface, and the side surface of the housing, and a second surface layer formed by applying a second texture and a second color to a second area within the first area, wherein at least one of the first surface layer and the second surface layer includes an oxide film layer.
Public/Granted literature
- US20170347476A1 HOUSING, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2017-11-30
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