Invention Grant
- Patent Title: Microneedle puncture instrument
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Application No.: US16240740Application Date: 2019-01-05
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Publication No.: US10449345B2Publication Date: 2019-10-22
- Inventor: Tomoya Sumida
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2016-140500 20160715
- Main IPC: A61M37/00
- IPC: A61M37/00 ; A61M5/42

Abstract:
A microneedle puncture instrument includes a pinch section including a first pinch element and a second pinch element arrayed in an array direction and configured to individually pinch the skin in a pinch direction, which intersects with the array direction, the first pinch element and the second pinch element being connected to each other with a distance therebetween maintained within a predetermined range; and a puncture section configured to puncture the skin while pinching the skin in the pinch direction at a position between the first pinch element and the second pinch element in the array direction, the puncture section including a microneedle for puncturing the skin and a support portion that supports the microneedle.
Public/Granted literature
- US20190134370A1 MICRONEEDLE PUNCTURE INSTRUMENT Public/Granted day:2019-05-09
Information query
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