Invention Grant
- Patent Title: Fluid ejection device
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Application No.: US15748301Application Date: 2015-10-30
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Publication No.: US10449762B2Publication Date: 2019-10-22
- Inventor: James R. Przybyla , Zhizhang Chen
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2015/058428 WO 20151030
- International Announcement: WO2017/074446 WO 20170504
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
According to an example, a fluid ejection device may include a substrate, a resistor positioned on the substrate, an overcoat layer positioned over the resistor, a fluidics layer having surfaces that form a firing chamber about the resistor, in which the overcoat layer is positioned between the resistor and the firing chamber, and a thin film membrane covering the surfaces of the fluidics layer that form the firing chamber and a portion of the overcoat layer that is in the firing chamber.
Public/Granted literature
- US20180222203A1 FLUID EJECTION DEVICE Public/Granted day:2018-08-09
Information query
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