Invention Grant
- Patent Title: Method and apparatus for encoding and decoding 3-dimensional audio signal
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Application No.: US15996939Application Date: 2018-06-04
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Publication No.: US10453462B2Publication Date: 2019-10-22
- Inventor: Young-woo Lee , Sun-min Kim , Hwan Shim , Nam-suk Lee , Hyun-Wook Kim , Jong-hoon Jeong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0060523 20120605
- Main IPC: H04R5/00
- IPC: H04R5/00 ; G10L19/008
Abstract:
A method of encoding a multi-channel 3-dimensional (3D) audio signal mixed with a multi-channel 3D object signal is provided. The method includes: obtaining a location parameter indicating a virtual location of the multi-channel 3D object signal on a multi-channel speaker layout based on a gain value of the multi-channel 3D object signal for each channel; and encoding the multi-channel 3D audio signal and the location parameter.
Public/Granted literature
- US20180286416A1 METHOD AND APPARATUS FOR ENCODING AND DECODING 3-DIMENSIONAL AUDIO SIGNAL Public/Granted day:2018-10-04
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