发明授权
- 专利标题： Conductor assembly, electronic component using same, and manufacturing method thereof
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申请号： US15564442申请日： 2016-12-15
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公开(公告)号： US10453587B2公开(公告)日： 2019-10-22
- 发明人: Ikuya Wakamori , Kengo Nakamura , Mutsuyasu Ohtsubo
- 申请人： Panasonic Intellectual Property Management Co., Ltd.
- 申请人地址： JP Osaka
- 专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2015-250147 20151222; JP2016-009421 20160121
- 国际申请： PCT/JP2016/005138 WO 20161215
- 国际公布： WO2017/110064 WO 20170629
- 主分类号： H01R4/02
- IPC分类号： H01R4/02 ; H01B5/00 ; B23K11/14 ; H01B13/00 ; H05K3/20 ; H05K3/32 ; B23K11/11 ; B23K11/16 ; H01R43/02 ; B23K101/38 ; B23K103/12
摘要：
A conductor assembly includes a first conductor made of metal and a second conductor bonded to the first conductor. The second conductor is made of a metal plate having first and second surfaces opposite to each other. The second conductor has a projection locally projecting from the first surface. A recess is provided in the second surface of the second conductor opposite to the projection. The projection of the second conductor has a portion contacting and entering into the first conductor. The projection of the second conductor is resistance-welded to the first conductor. The portion of the projection of the second conductor has two tips locally projecting from the portion of the projection of the second conductor and entering the first conductor.
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