Invention Grant
- Patent Title: Package MEMS switch and method
-
Application No.: US15633237Application Date: 2017-06-26
-
Publication No.: US10453635B2Publication Date: 2019-10-22
- Inventor: Qing Ma , Johanna Swan , Valluri Rao , Feras Eid
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01H59/00 ; H01Q5/314 ; H01H50/00
Abstract:
An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.
Public/Granted literature
- US20180138001A1 PACKAGE MEMS SWITCH AND METHOD Public/Granted day:2018-05-17
Information query
