- Patent Title: Package with roughened encapsulated surface for promoting adhesion
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Application No.: US15709493Application Date: 2017-09-20
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Publication No.: US10453771B2Publication Date: 2019-10-22
- Inventor: Andreas Grassmann , Juergen Hoegerl , Kiyoung Jang , Ivan Nikitin
- Applicant: Infineon Technologies AG , HYUNDAI Motor Company , Kia Motor Corporation
- Applicant Address: DE Neubiberg KR Seoul KR Seoul
- Assignee: Infineon Technologies AG,HYUNDAI Motor Company,Kia Motor Corporation
- Current Assignee: Infineon Technologies AG,HYUNDAI Motor Company,Kia Motor Corporation
- Current Assignee Address: DE Neubiberg KR Seoul KR Seoul
- Priority: DE102016117841 20160921
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/367 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/373 ; H01L23/433 ; H01L23/00 ; H01L25/18
Abstract:
A package comprising at least one electronic chip, a first heat removal body thermally coupled to a first main surface of the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and part of the first heat removal body, wherein at least part of a surface of the first heat removal body is roughened.
Public/Granted literature
- US10410949B2 Package with roughened encapsulated surface for promoting adhesion Public/Granted day:2019-09-10
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