Invention Grant
- Patent Title: Three-dimensional semiconductor device
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Application No.: US15928559Application Date: 2018-03-22
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Publication No.: US10453857B2Publication Date: 2019-10-22
- Inventor: Jung Hwan Lee , Jee Yong Kim , Seok Jung Yun , Ji Hyeon Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2017-0097636 20170801
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L27/11582 ; H01L27/1157 ; H01L27/11565 ; H01L21/768 ; H01L23/522 ; H01L23/528

Abstract:
A three-dimensional semiconductor device includes gate electrodes including pad regions sequentially lowered by a first step portion in a first direction and sequentially lowered by a second step portion in a second direction perpendicular to the first direction, the second step portion being lower than the first step portion, wherein a length of a single pad region among pad regions sequentially lowered by the second step portion in the second direction is less than a length of a remainder of the pad regions in the second direction.
Public/Granted literature
- US20190043880A1 THREE-DIMENSIONAL SEMICONDUCTOR DEVICE Public/Granted day:2019-02-07
Information query
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