Invention Grant
- Patent Title: Enhanced puncturing and low-density parity-check (LDPC) code structure
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Application No.: US15593035Application Date: 2017-05-11
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Publication No.: US10454499B2Publication Date: 2019-10-22
- Inventor: Thomas Joseph Richardson , Shrinivas Kudekar
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm IP Dept.
- Agent James Hunt Yancey, Jr.
- Main IPC: H03M13/00
- IPC: H03M13/00 ; H03M13/11 ; H03M13/03

Abstract:
Certain aspects of the present disclosure generally relate to techniques for enhanced puncturing and low-density parity-check (LDPC) code structure. A method for wireless communications by a transmitting device is provided. The method generally includes encoding a set of information bits based on a LDPC code to produce a code word, the LDPC code defined by a base matrix having a first number of variable nodes and a second number of check nodes; puncturing the code word according to a puncturing pattern designed to puncture bits corresponding to at least two of the variable nodes to produce a punctured code word; adding at least one additional parity bit for the at least two punctured variable nodes; and transmitting the punctured code word.
Public/Granted literature
- US20170331497A1 ENHANCED PUNCTURING AND LOW-DENSITY PARITY-CHECK (LDPC) CODE STRUCTURE Public/Granted day:2017-11-16
Information query
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