A seal arrangement for joining a first component to a second component is disclosed. The seal arrangement may have a first sealing surface formed as an integral portion of the first component, and a second sealing surface formed as an integral portion of the second component and configured to directly engage the first sealing surface. The seal arrangement may also have an energizer engaged with the first sealing surface and configured to inhibit movement of the first sealing surface away from the second sealing surface during a temperature drop.