Invention Grant
- Patent Title: Tandem water spot cooling device for top die
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Application No.: US15483037Application Date: 2017-04-10
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Publication No.: US10456822B2Publication Date: 2019-10-29
- Inventor: Lin Zhu , Changhai Li , Hongbiao Li , Yong Li
- Applicant: CITIC Dicastal CO., LTD
- Applicant Address: CN Qinhuangdao
- Assignee: CITIC Dicastal CO., LTD
- Current Assignee: CITIC Dicastal CO., LTD
- Current Assignee Address: CN Qinhuangdao
- Agency: Maier & Maier, PLLC
- Priority: CN201610216598 20160408
- Main IPC: B22C9/06
- IPC: B22C9/06 ; B22D17/22 ; B22D18/04 ; B21D37/16 ; B21D22/02 ; B21D53/26

Abstract:
A tandem water spot cooling device for a top die. The device includes a spot cooling device main body, a lower sealing plate, an outer-ring circular track, an inner-ring serpentine passage, outer-ring flow dividing baffles, inner-ring flow dividing baffles, outer-ring through holes, inner-ring through holes, bolt hole reservation positions, stripper rod reservation positions, and water inlet and outlet connection through holes.
Public/Granted literature
- US20170291212A1 Tandem Water Spot Cooling Device for Top Die Public/Granted day:2017-10-12
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