Invention Grant
- Patent Title: Thermal flow-rate sensor
-
Application No.: US15554112Application Date: 2016-02-08
-
Publication No.: US10458825B2Publication Date: 2019-10-29
- Inventor: Yukikatsu Ozaki , Hirohito Matsui , Toshikazu Harada
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya, Aichi-pref.
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya, Aichi-pref.
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2015-040555 20150302
- International Application: PCT/JP2016/053667 WO 20160208
- International Announcement: WO2016/140019 WO 20160909
- Main IPC: G01F1/684
- IPC: G01F1/684 ; G01F1/688

Abstract:
A thermal flow-rate sensor includes: a first temperature sensor that detects the temperature at a specified location of the outer-wall surface of a pipe; a heat-transfer element that is arranged on the outer-wall surface of the pipe in a state separated from the first temperature sensor, and that exchanges heat with a measurement medium by heating or cooling the outer-wall surface of the pipe; a second temperature sensor that detects the temperature of a portion of the outer-wall surface of the pipe that is heated or cooled by the heat-transfer element; and a control unit that performs specified processing. A heat-flux sensor is arranged between the heat-transfer element and the outer-wall surface of the pipe and directly detects heat flux between the heat-transfer element and the pipe; and the control unit detects the flow rate of the measurement medium based on the temperature that is directly detected by the first temperature sensor, the temperature that is detected by the second temperature sensor, and the heat flux that is detected by the heat-flux sensor.
Public/Granted literature
- US20180038722A1 THERMAL FLOW-RATE SENSOR Public/Granted day:2018-02-08
Information query