Invention Grant
- Patent Title: System and method of inspecting device under test, and method of manufacturing semiconductor device
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Application No.: US16053192Application Date: 2018-08-02
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Publication No.: US10459348B2Publication Date: 2019-10-29
- Inventor: Myung-Ho Jung , Ji-Hoon Kang , Sean Park , Sung-Won Park , Jae-Min Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0146991 20171106
- Main IPC: H04N7/18
- IPC: H04N7/18 ; G01N21/95 ; G03F7/20

Abstract:
Inspection system for a device under test (DUT) includes an image sensor, N image obtaining devices, K switches, M image processing devices, and at least one added image processing device. The image obtaining devices are connected to the image sensor, and each of the N image obtaining devices receives image data of the image of the DUT captured by the image sensor. Each of the K switches is connected to a respective one of the image obtaining devices. Each of the M image processing devices is connected to a respective one of the switches, receives the image data that is output from one of the N image obtaining devices and is distributed by one of the K switches, and generates processed image data in real-time. The added image processing device is connected to one of the switches, receives the image data, and generates additional processed image data in real-time.
Public/Granted literature
- US20190137884A1 SYSTEM AND METHOD OF INSPECTING DEVICE UNDER TEST, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2019-05-09
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