Invention Grant
- Patent Title: Encapsulated pressure sensor
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Application No.: US15276341Application Date: 2016-09-26
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Publication No.: US10459537B2Publication Date: 2019-10-29
- Inventor: Dominique Paul Barbier
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: US TX Coppell
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Coppell
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: G06F3/0354
- IPC: G06F3/0354 ; G06F3/038 ; G06F3/0488 ; G06F3/041 ; G01L5/22
Abstract:
An encapsulated pressure sensor includes a pressure sensor having a pressure sensing surface and a mounting surface. The mounting surface is attached to a mounting substrate. A fluid contacts the pressure sensing surface of the pressure sensor. A deformable encapsulating member is attached to the mounting substrate and encapsulates the pressure sensor and the fluid.
Public/Granted literature
- US20170090604A1 ENCAPSULATED PRESSURE SENSOR Public/Granted day:2017-03-30
Information query
IPC分类:
