Invention Grant
- Patent Title: Package with partially encapsulated cooling channel for cooling an encapsulated chip
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Application No.: US15665574Application Date: 2017-08-01
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Publication No.: US10461017B2Publication Date: 2019-10-29
- Inventor: Andreas Grassmann , Wolfram Hable , Juergen Hoegerl , Ivan Nikitin , Achim Strass
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102016114303 20160802
- Main IPC: H01L23/473
- IPC: H01L23/473 ; B60R16/02 ; H01L21/56 ; H01L23/31 ; H01L23/433 ; H01L23/46 ; H01L21/48 ; H01L23/373 ; H01L23/42 ; H01L23/00 ; H01L25/07
Abstract:
A power module which comprises a semiconductor chip, at least one cooling plate with at least one cooling channel thermally coupled to the semiconductor chip and being configured so that a coolant is guidable through the at least one cooling channel, and an encapsulant encapsulating at least part of the semiconductor chip and part of the at least one cooling channel, wherein at least part of a main surface of the cooling plate forms part of an external surface of the power module.
Public/Granted literature
- US20180040537A1 Package with partially encapsulated cooling channel for cooling an encapsulated chip Public/Granted day:2018-02-08
Information query
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