- Patent Title: Integrated circuit devices and methods of manufacturing the same
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Application No.: US16003959Application Date: 2018-06-08
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Publication No.: US10461187B2Publication Date: 2019-10-29
- Inventor: Mirco Cantoro , Yeon-cheol Heo , Maria Toledano Luque
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2016-0064936 20160526
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/207 ; H01L21/306 ; H01L29/04 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/66 ; H01L29/20 ; H01L29/423

Abstract:
An integrated circuit device may include a substrate including a main surface, a compound semiconductor nanowire extending from the main surface in a first direction perpendicular to the main surface and including a first section and a second section alternately arranged in the first direction, a gate electrode covering the first section, and a gate dielectric layer between the first section and the gate electrode. The first section and the second section may have the same composition as each other and may have different crystal phases from each other.
Public/Granted literature
- US20180294353A1 INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2018-10-11
Information query
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