Invention Grant
- Patent Title: Memory module cooler with vapor chamber device connected to heat pipes
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Application No.: US15800695Application Date: 2017-11-01
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Publication No.: US10462932B2Publication Date: 2019-10-29
- Inventor: Travis J. Gaskill
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/02 ; H01L23/427

Abstract:
An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.
Public/Granted literature
- US20190131204A1 MEMORY MODULE COOLER WITH VAPOR CHAMBER DEVICE CONNECTED TO HEAT PIPES Public/Granted day:2019-05-02
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