Invention Grant
- Patent Title: Apparatus for measuring thickness and surface profile of multilayered film structure using imaging spectral optical system and measuring method
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Application No.: US15538846Application Date: 2016-08-26
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Publication No.: US10466031B2Publication Date: 2019-11-05
- Inventor: Young-Sik Ghim , Hyug-Gyo Rhee , Yun Woo Lee
- Applicant: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE
- Applicant Address: KR Daejeon
- Assignee: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE
- Current Assignee: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE
- Current Assignee Address: KR Daejeon
- Agency: Allen, Dyer, Doppelt + Gilchrist, P.A.
- Priority: KR10-2016-0075238 20160616
- International Application: PCT/KR2016/009500 WO 20160826
- International Announcement: WO2017/217590 WO 20171221
- Main IPC: G01B9/02
- IPC: G01B9/02 ; G01B11/06 ; G06F17/16 ; G06F17/17 ; G01B11/24
Abstract:
The present disclosure relates to an apparatus for measuring a thickness and a surface profile of a multilayered film structure using an imaging spectral optical system and a measuring method. More specifically, the present disclosure relates to a method and an apparatus which measure a thickness and a surface profile of a multilayered thin film structure by applying a method for obtaining an absolute reflectance value for an object to be measured having a multilayered thin film using a reflected light measuring method and extracting a phase from an interference signal with a reference mirror using a phase shift algorithm.
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