Invention Grant
- Patent Title: Conductive probe interconnects and related devices and methods
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Application No.: US15795684Application Date: 2017-10-27
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Publication No.: US10468056B2Publication Date: 2019-11-05
- Inventor: Stefan A. Weissner , Wayne A. Bonin , James R. Krolnik
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: Kagan Binder, PLLC
- Main IPC: G11B5/48
- IPC: G11B5/48 ; G11B5/455 ; G01R33/12 ; G11B5/00
Abstract:
Described are probe assemblies that include multiple layers, including at least one layer of probe bodies; suspension assemblies and components thereof, e.g., head gimbal assemblies, that include a probe assembly as described; and methods of using the probe assemblies and suspension assemblies.
Public/Granted literature
- US20190130938A1 CONDUCTIVE PROBE INTERCONNECTS AND RELATED DEVICES AND METHODS Public/Granted day:2019-05-02
Information query
IPC分类:
