A light-emitting apparatus including a mother board, and LED packages mounted on the mother board is provided. Each of the LED packages includes: a package substrate; light-emitting regions on the package substrate, the light-emitting regions being rotationally symmetric and each including LED devices, wherein at least some of the light-emitting regions and the other light-emitting regions emit light of different colors; and sets of package electrodes on the package substrate around the light-emitting regions, the sets of package electrodes being rotationally symmetric, wherein the package electrodes of each set correspond to cathodes and anodes of the light-emitting regions capable of emitting light independently of each other. The mother board includes, for each LED package, a set of mother-board electrodes connected to one of the sets of package electrodes of the LED package.