Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.