Invention Grant
- Patent Title: Printed circuit board assembly
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Application No.: US15112363Application Date: 2014-01-31
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Publication No.: US10473871B2Publication Date: 2019-11-12
- Inventor: Kevin B Leigh , Paul Kessler Rosenberg , George D Megason
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2014/013978 WO 20140131
- International Announcement: WO2015/116122 WO 20150806
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/43

Abstract:
An optoelectronic assembly for a printed circuit board (PCB) assembly is described herein. The optoelectronic assembly may include a component carrier for mounting an active component, and a connector assembly for achieving a coupling between the component carrier and PCB-side optical infrastructure on a printed circuit board (PCB). The connector assembly can include a plurality of optical fibers connected to the component carrier, a first optical connector connected to the optical fibers for coupling with the PCB-side optical infrastructure on the PCB, and a housing member for housing the optical fibers and the first optical connector.
Public/Granted literature
- US20160334594A1 PRINTED CIRCUIT BOARD ASSEMBLY Public/Granted day:2016-11-17
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