Invention Grant
- Patent Title: Feedthrough capacitor
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Application No.: US15903976Application Date: 2018-02-23
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Publication No.: US10475587B2Publication Date: 2019-11-12
- Inventor: Toru Onoue , Daisuke Himeta , Hikaru Hirabayashi , Fumiaki Satoh , Yuma Hattori , Takuto Okamoto
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2017-065398 20170329
- Main IPC: H01G4/35
- IPC: H01G4/35 ; H01G4/232 ; H01G4/30

Abstract:
A first external electrode is disposed on an end surface. A second external electrode is disposed on a side surface. The first external electrode includes a first sintered electrode layer, a second sintered electrode layer disposed on the first sintered electrode layer, and a plated layer disposed on the second sintered electrode layer. The second external electrode includes a third sintered electrode layer and a plated layer disposed on the third sintered electrode layer. The first, second, and third sintered electrode layers include a void. A void fraction of each of the first and third sintered electrode layers is larger than a void fraction of the second sintered electrode layer.
Public/Granted literature
- US20180286583A1 FEEDTHROUGH CAPACITOR Public/Granted day:2018-10-04
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