- 专利标题： Semiconductor module and conductive member for semiconductor module including cut in bent portion
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申请号： US15518353申请日： 2014-11-06
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公开(公告)号： US10475667B2公开(公告)日： 2019-11-12
- 发明人: Masakazu Tani , Yoshiyuki Deguchi , Kazuki Sakata
- 申请人： Mitsubishi Electric Corporation
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Electric Corporation
- 当前专利权人： Mitsubishi Electric Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 代理商 Richard C. Turner
- 国际申请： PCT/JP2014/079418 WO 20141106
- 国际公布： WO2016/071982 WO 20160512
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/48 ; H01L25/07 ; H01L25/18 ; H01L21/768 ; H01L23/498 ; H01L23/00
摘要：
A semiconductor module is provided with a conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode. The conductive member is made up of a metal sheet, and has a bent portion at the one end and at the other end. The bent portion provided at the one end has a cut in a leading end portion, in the longitudinal direction, and an end joining section at which the cut is not present is joined to the electrode of the semiconductor element. As a result, a semiconductor module can be realized that allows combination of increased current capacity with improved reliability.
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