- 专利标题： Die bonder and methods of using the same
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申请号： US14686142申请日： 2015-04-14
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公开(公告)号： US10475764B2公开(公告)日： 2019-11-12
- 发明人: Chen-Hua Yu , Shing-Chao Chen , Chung-Shi Liu , Ming-Da Cheng
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/67 ; B32B37/02 ; B32B38/18 ; H01L21/56
摘要：
A method includes bringing into contact respective first sides of a plurality of dies and a die attach film on a major surface of a carrier wafer, and simultaneously heating portions of the die attach film contacting the plurality of dies in order to simultaneously bond the plurality of dies to the die attach film.
公开/授权文献
- US20160190088A1 Die Bonder and Methods of Using the Same 公开/授权日：2016-06-30
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