Invention Grant
- Patent Title: Enhanced channel interleaving for optimized data throughput
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Application No.: US15991712Application Date: 2018-05-29
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Publication No.: US10476627B2Publication Date: 2019-11-12
- Inventor: Naga Bhushan , Peter John Black
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Holland & Hart LLP
- Main IPC: H04L1/00
- IPC: H04L1/00 ; H04L5/00 ; H04L1/18

Abstract:
In a transmission scheme wherein multi-slot packet transmissions to a remote station can be terminated by an acknowledgment signal from the remote station, code symbols can be efficiently packed over the multi-slot packet so that the remote station can easily decode the data payload of the multi-slot packet by decoding only a portion of the multi-slot packet. Hence, the remote station can signal for the early termination of the multi-slot packet transmission, which thereby increases the data throughput of the system.
Public/Granted literature
- US20180278363A1 ENHANCED CHANNEL INTERLEAVING FOR OPTIMIZED DATA THROUGHPUT Public/Granted day:2018-09-27
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