Invention Grant
- Patent Title: Manufacturing method for EMI shielding structure
-
Application No.: US15488024Application Date: 2017-04-14
-
Publication No.: US10477687B2Publication Date: 2019-11-12
- Inventor: Il-ju Mun , Keon Kuk , Ji-woon Yeom
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2016-0154190 20161118
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H01L23/552 ; H05K9/00 ; H05K1/02 ; B05D1/26 ; B05D7/00

Abstract:
An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.
Public/Granted literature
- US20180042147A1 EMI SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-02-08
Information query