Invention Grant
- Patent Title: Receptacle assembly and thermal-transfer assembly
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Application No.: US15959973Application Date: 2018-04-23
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Publication No.: US10477729B2Publication Date: 2019-11-12
- Inventor: Hongqiang Han , Jiwang Jin , Wenyu Liu , Nikhil Shankar , Alex Michael Sharf , Chenxi Wang
- Applicant: TE CONNECTIVITY CORPORATION , Tyco Electronics (Shanghai) Co., Ltd.
- Applicant Address: US PA Berwyn CN Shanghai
- Assignee: TE CONNECTIVITY CORPORATION,TYCO ELECTRONICS (SHANGHAI) CO., LTD.
- Current Assignee: TE CONNECTIVITY CORPORATION,TYCO ELECTRONICS (SHANGHAI) CO., LTD.
- Current Assignee Address: US PA Berwyn CN Shanghai
- Priority: CN201810066104 20180123
- Main IPC: F28F3/06
- IPC: F28F3/06 ; F28F9/00 ; H05K7/14 ; H05K7/20

Abstract:
Receptacle assembly includes a receptacle cage and a thermal-transfer module that is coupled to a thermal side of the receptacle cage. The thermal-transfer module has a base portion and a plurality of heat-transfer fins coupled to the base portion. The thermal-transfer module is configured to absorb thermal energy from a pluggable transceiver in the receptacle cage and transfer the thermal energy through the base portion and to the heat-transfer fins. The receptacle assembly also includes a retention clip configured to hold the thermal-transfer module to the receptacle cage. The retention clip includes a resilient beam that extends across the thermal-transfer module. The resilient beam directly engages at least some of the heat-transfer fins and applies a resilient force against the heat-transfer fins.
Public/Granted literature
- US20190230817A1 RECEPTACLE ASSEMBLY AND THERMAL-TRANSFER ASSEMBLY Public/Granted day:2019-07-25
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