Invention Grant
- Patent Title: Printhead with flexible substrate
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Application No.: US15748844Application Date: 2015-10-12
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Publication No.: US10479081B2Publication Date: 2019-11-19
- Inventor: Silam J. Choy
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2015/055119 WO 20151012
- International Announcement: WO2017/065730 WO 20170420
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/155 ; B41J3/407 ; B41J2/14

Abstract:
In one example in accordance with the present disclosure a flexible printhead is described. The printhead includes a number of printhead die, a printhead die including a number of nozzles to deposit an amount of fluid onto a print medium. The printhead also includes a fluid delivery system to deliver the amount of fluid from a fluid supply to the number of nozzles. The printhead also includes a number of electrical circuits to electronically couple the number of printhead die with a printing device. The printhead also includes a flexible substrate on which the number of printhead die and the number of electrical circuits are mounted.
Public/Granted literature
- US20180215154A1 PRINTHEAD WITH FLEXIBLE SUBSTRATE Public/Granted day:2018-08-02
Information query
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