- 专利标题： Piezoresistive sensor with spring flexures for stress isolation
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申请号： US15416801申请日： 2017-01-26
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公开(公告)号： US10481025B2公开(公告)日： 2019-11-19
- 发明人: Timothy Thomas Golly , David P. Potasek , Cuong Tho Huynh
- 申请人： Rosemount Aerospace Inc.
- 申请人地址： US MN Burnsville
- 专利权人： Rosemount Aerospace Inc.
- 当前专利权人： Rosemount Aerospace Inc.
- 当前专利权人地址： US MN Burnsville
- 代理机构： Kinney & Lange, P.A.
- 主分类号： G01L9/00
- IPC分类号： G01L9/00 ; G01L19/14
摘要：
A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.
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