- 专利标题： Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture
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申请号： US15982616申请日： 2018-05-17
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公开(公告)号： US10483192B2公开(公告)日： 2019-11-19
- 发明人: Aira Lourdes Villamor , Erwin Victor Cruz , Geraldine Suico , Silnore Sabando
- 申请人： FAIRCHILD SEMICONDUCTOR CORPORATION
- 申请人地址： US AZ Phoenix
- 专利权人： FAIRCHILD SEMICONDUCTOR CORPORATION
- 当前专利权人： FAIRCHILD SEMICONDUCTOR CORPORATION
- 当前专利权人地址： US AZ Phoenix
- 代理机构： Brake Hughes Bellermann LLP
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; H01L23/495 ; H01L23/492 ; H01L21/56 ; H01L21/48 ; H01L23/31
摘要：
In a general aspect, a method for producing a packaged semiconductor device can include coupling a semiconductor device to a leadframe structure having a signal lead that is electrically coupled with the semiconductor device. The method can also include encapsulating at least a portion of the semiconductor device and at least a portion of the leadframe structure in a molding compound. At least a segment of the signal lead can be exposed outside the molding compound. A surface of the molding compound can define a primary plane of the packaged semiconductor device. The method can further include forming, with a laser, a groove in the segment, applying solder plating to the segment, including the groove, and separating, at the groove, the segment into a first portion and a second portion, such that the second portion of the segment is separated from the leadframe structure.