Invention Grant
- Patent Title: Composite formulation and composite article
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Application No.: US15275100Application Date: 2016-09-23
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Publication No.: US10485149B2Publication Date: 2019-11-19
- Inventor: Megan Hoarfrost Beers , Jialing Wang , Jaydip Das , Richard B. Lloyd , James Toth , Ting Gao
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: H05K9/00
- IPC: H05K9/00 ; B32B27/08 ; B32B27/20 ; B32B27/30 ; B32B27/34 ; C08K3/08 ; C08K9/10 ; C08K7/00 ; H01B1/22

Abstract:
A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.
Public/Granted literature
- US20180092258A1 Composite Formulation and Composite Article Public/Granted day:2018-03-29
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