Laminate, printed circuit board and method for producing laminate
Abstract:
To provide a laminate having a fluororesin layer and a thermoplastic resin layer laminated with a good adhesive strength.A method for producing a laminate, comprising carrying out heat lamination of a fluororesin film containing the following fluororesin (A) and a thermoplastic resin film containing a thermoplastic resin (B) having a melting point higher by at least 5° C. than the melting point of the fluororesin (A), at a temperature of at least a melting point of the fluororesin (A) and lower than a melting point of the thermoplastic resin (B). The fluororesin (A) is a fluororesin having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melt flow rate of from 0.5 to 30 g/10 min at 372° C. under a load of 49N.
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