- Patent Title: Laminate, printed circuit board and method for producing laminate
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Application No.: US16152637Application Date: 2018-10-05
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Publication No.: US10507631B2Publication Date: 2019-12-17
- Inventor: Tatsuya Terada , Toru Sasaki
- Applicant: AGC Inc.
- Applicant Address: JP Chiyoda-ku
- Assignee: AGC Inc.
- Current Assignee: AGC Inc.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2016-078950 20160411
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B7/02 ; B32B15/04 ; B32B15/082 ; B32B27/30 ; H05K1/03 ; B32B15/08 ; B32B37/18 ; H05K3/46

Abstract:
To provide a laminate having a fluororesin layer and a thermoplastic resin layer laminated with a good adhesive strength.A method for producing a laminate, comprising carrying out heat lamination of a fluororesin film containing the following fluororesin (A) and a thermoplastic resin film containing a thermoplastic resin (B) having a melting point higher by at least 5° C. than the melting point of the fluororesin (A), at a temperature of at least a melting point of the fluororesin (A) and lower than a melting point of the thermoplastic resin (B). The fluororesin (A) is a fluororesin having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melt flow rate of from 0.5 to 30 g/10 min at 372° C. under a load of 49N.
Public/Granted literature
- US20190030870A1 LAMINATE, PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING LAMINATE Public/Granted day:2019-01-31
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