A fingerprint identification apparatus having a conductive structure includes an insulated casing, a conductive wire, and a fingerprint identification module. The insulated casing has a first surface with a fingerprint detection region and a second surface. The conductive wire has a first wire segment and a second wire segment. The first wire segment forms on the first surface and contacts with the fingerprint detection region. The second wire segment forms on the second surface and electrically connects to the first wire segment. The fingerprint identification module is disposed on the second surface and electrically connected to the second wire segment. Therefore, the conductive structure for fingerprint identification is provided to increase accuracy and security of the fingerprint identification and reduce manufacturing costs.