Invention Grant
- Patent Title: Anisotropic conductive film (ACF) and forming method thereof, ACF roll, bonding structure and display device
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Application No.: US15994529Application Date: 2018-05-31
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Publication No.: US10510708B2Publication Date: 2019-12-17
- Inventor: Wei Li , Wei He , Jing Wang , Chao Fu , Chaofan Li , Zhiyong Yang , Liwei Huang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Chengdu
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Chengdu
- Priority: CN201710626425 20170727
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
Embodiments of the present disclosure provide an anisotropic conductive film and a forming method thereof, an ACF roll, a bonding structure and a display device. The anisotropic conductive film (ACF) includes: an insulating adhesive layer, including a plurality of preset regions corresponding to electrodes to be bonded and spaced from each other; and capsule structures, dispersed in the insulating adhesive layer of the plurality of preset regions and configured to realize a electrical connection in a direction perpendicular to a surface of the ACF when the ACF is subjected to a pressure in the direction perpendicular to the surface of the ACF, wherein a number of the capsule structures in each of the plurality of preset regions is greater than a preset number.
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