- 专利标题: Integrated fan-out package including dielectric waveguide
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申请号: US16168649申请日: 2018-10-23
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公开(公告)号: US10511075B2公开(公告)日: 2019-12-17
- 发明人: Chewn-Pu Jou , Wen-Shiang Liao
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理商 Maschoff Brennan
- 主分类号: H01P3/16
- IPC分类号: H01P3/16 ; G02F1/025 ; G02B6/132 ; G02B6/122 ; G02B6/42 ; G02F1/01
摘要:
A semiconductor structure is disclosed that includes a dielectric waveguide, a first transmission electrode and a second transmission electrode, and a first receiver electrode and a second receiver electrode. The first transmission electrode and the second transmission electrode that are disposed over and below the dielectric waveguide, respectively, and the first transmission electrode and the second transmission electrode are symmetric with respect to the dielectric waveguide. The first receiver electrode and a second receiver electrode that are disposed over and below the dielectric waveguide, respectively, and the first receiver electrode and the second receiver electrode are symmetric with respect to the dielectric waveguide. The dielectric waveguide is configured to receive a transmission signal from a driver circuit through the first transmission electrode and to transmit the received transmission signal to a receiver circuit through the first receiver electrode.
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