- 专利标题: Elastic wave device and method for manufacturing the same
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申请号: US15666596申请日: 2017-08-02
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公开(公告)号: US10511279B2公开(公告)日: 2019-12-17
- 发明人: Munehisa Watanabe , Hideki Iwamoto , Hajime Kando , Syunsuke Kido
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2010-288453 20101224
- 主分类号: H03H9/02
- IPC分类号: H03H9/02 ; H03H3/02 ; H03H3/04 ; H03H3/08 ; H01L41/04 ; H01L41/047 ; H03H9/54 ; H03H3/10 ; H01L41/18 ; H01L41/22
摘要:
An elastic wave device includes a supporting substrate, a high-acoustic-velocity film stacked on the supporting substrate and in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in a piezoelectric film, a low-acoustic-velocity film stacked on the high-acoustic-velocity film and in which an acoustic velocity of a bulk wave propagating therein is lower than an acoustic velocity of a bulk wave propagating in the piezoelectric film, the piezoelectric film is stacked on the low-acoustic-velocity film, and an IDT electrode stacked on a surface of the piezoelectric film.
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