- 专利标题: Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP
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申请号: US15274590申请日: 2016-09-23
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公开(公告)号: US10515828B2公开(公告)日: 2019-12-24
- 发明人: Yaojian Lin , Heinz-Peter Wirtz , Seung Wook Yoon , Pandi C. Marimuthu
- 申请人: STATS ChipPAC Pte. Ltd.
- 申请人地址: SG Singapore
- 专利权人: STATS ChipPAC Pte. Ltd.
- 当前专利权人: STATS ChipPAC Pte. Ltd.
- 当前专利权人地址: SG Singapore
- 代理机构: Patent Law Group: Atkins and Associates, P.C.
- 代理商 Brian M. Kaufman; Robert D. Atkins
- 主分类号: H01L21/56
- IPC分类号: H01L21/56 ; H01L23/28 ; H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L21/3105
摘要:
A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface.