Invention Grant
- Patent Title: Kelvin contact assembly and method of installation thereof
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Application No.: US15438721Application Date: 2017-02-21
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Publication No.: US10527646B2Publication Date: 2020-01-07
- Inventor: Wei Kuong Foong , Kok Sing Goh , Shamal Mundiyath , Eng Kiat Lee
- Applicant: JF MICROTECHNOLOGY SDN. BHD.
- Applicant Address: MY Petaling Jaya
- Assignee: JF MICROTECHNOLOGY SDN. BHD.
- Current Assignee: JF MICROTECHNOLOGY SDN. BHD.
- Current Assignee Address: MY Petaling Jaya
- Agency: Maschoff Brennan
- Priority: MYPI2016000320 20160222
- Main IPC: G01R1/04
- IPC: G01R1/04 ; H01L21/66 ; H01L23/522 ; H01L23/528

Abstract:
An electrical contact assembly comprised of four identical modules arranged in a four-sided formation. Each module comprises of a bottom housing formed with two rows of through holes to allow a row of front and back contact pairs to be inserted, with separators in between each pair to prevent electrical conductance between the pairs. A top housing is then lowered onto the top of these contact pairs. With the aid of a key tool, the rows of contact pairs are inserted into through holes in the top housing. By virtue of different heights between the front and back rows of through holes, the front and back contact rows are inserted one first, and then the other. This allows for easier installation of an assembly with minimal tolerance accumulation.
Public/Granted literature
- US20170242055A1 KELVIN CONTACT ASSEMBLY AND METHOD OF INSTALLATION THEREOF Public/Granted day:2017-08-24
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