- 专利标题： Solid-state imaging apparatus and method of manufacturing the same
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申请号： US15944942申请日： 2018-04-04
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公开(公告)号： US10529762B2公开(公告)日： 2020-01-07
- 发明人: Masahiko Shimizu , Toshiaki Iwafuchi
- 申请人： SONY CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Chip Law Group
- 优先权： JP2011-033687 20110218
- 主分类号： H01L27/146
- IPC分类号： H01L27/146 ; H01L23/00
摘要：
A solid-state imaging apparatus includes an imaging section and a substrate. The imaging section has a light-receiving portion for receiving light from an object to image the object and the imaging section is disposed on the substrate. A member is provided on the substrate in the neighborhood of the light receiving portion and the member is partially or entirely coated in black.
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