Invention Grant
- Patent Title: Grip apparatus and substrate inspection system including the same, and method of manufacturing semiconductor device using the substrate inspection system
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Application No.: US15991668Application Date: 2018-05-29
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Publication No.: US10532896B2Publication Date: 2020-01-14
- Inventor: Kuihyun Yoon , Wonguk Seo , Young Heo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chan & Associates, LLC
- Priority: KR10-2017-0124464 20170926
- Main IPC: B65G49/06
- IPC: B65G49/06 ; G01N21/88 ; H01L21/677

Abstract:
A substrate inspection system includes a floating unit that floats a substrate, an inspection unit disposed above the floating unit, a grip unit disposed below the inspection unit and including a first grip member that holds the substrate on the floating unit, a grip transfer unit that moves the grip unit in a first direction, and an illumination unit that generates light. The inspection unit inspects the substrate that floats on the floating unit, the illumination unit is disposed on a moving path of the grip unit, and the light generated by the illumination unit is irradiated onto the inspection unit. The first grip member includes a first adsorption pad that adsorbs the substrate, and a first support member that supports the first adsorption pad and that includes a first opening into which the illumination unit is inserted.
Public/Granted literature
Information query
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