- 专利标题: Stress reduction dimples for circular holes
-
申请号: US15351783申请日: 2016-11-15
-
公开(公告)号: US10533420B2公开(公告)日: 2020-01-14
- 发明人: Paul Stone
- 申请人: PRATT & WHITNEY CANADA CORP.
- 申请人地址: CA Longueuil, Quebec
- 专利权人: Pratt & Whitney Canada Corp.
- 当前专利权人: Pratt & Whitney Canada Corp.
- 当前专利权人地址: CA Longueuil, Quebec
- 代理机构: Norton Rose Fulbright Canada L.L.P.
- 主分类号: B23P13/00
- IPC分类号: B23P13/00 ; F01D5/02 ; B64D27/10
摘要:
A method of reducing stress concentration in a material subjected to a predominant stress in a direction parallel to an axial plane defined through an axis of a circular cylindrical hole in the material between a first material surface and a second material surface, the material having a material thickness defined between the first material surface and the second material surface, the method comprising: forming a first proximal recess in the first material surface on the axial plane having a depth less than the material thickness, the first proximal recess having an outer edge spaced a first proximal dimension in the axial plane from a first rim of the hole; and forming a second proximal recess in the second material surface on the axial plane having a depth less than the material thickness, the second proximal recess having an outer edge spaced a second proximal dimension in the axial plane from a second rim of the hole, wherein the first proximal dimension on the first material surface is diametrically opposite, relative to the hole, to the second proximal dimension on the second material surface.
公开/授权文献
- US20180135415A1 STRESS REDUCTION DIMPLES FOR CIRCULAR HOLES 公开/授权日:2018-05-17
信息查询