Invention Grant
- Patent Title: Stitched devices
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Application No.: US15402166Application Date: 2017-01-09
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Publication No.: US10535645B2Publication Date: 2020-01-14
- Inventor: Wei Shao , Juan Boon Tan , Wei Liu , Wanbing Yi
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: CA Ottawa
- Assignee: ALSEPHINA INNOVATIONS INC.
- Current Assignee: ALSEPHINA INNOVATIONS INC.
- Current Assignee Address: CA Ottawa
- Agency: Thompson Hine LLP
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L21/48 ; H01L21/76 ; H01L23/49 ; H01L21/768 ; H01L23/528 ; H01L23/498 ; H01L23/522 ; H01L23/00 ; H01L25/065 ; H01L25/00
Abstract:
A stitched device is disclosed. The stitched device includes first and second base devices having first and second stitched interconnects electrically coupled in a stitching level. This enables a single substrate of the stitched device to have electrically coupled first and second base devices.
Public/Granted literature
- US20170125396A1 STITCHED DEVICES Public/Granted day:2017-05-04
Information query
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