Invention Grant
- Patent Title: Heat dissipation structure and display device
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Application No.: US16338523Application Date: 2017-07-05
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Publication No.: US10537047B2Publication Date: 2020-01-14
- Inventor: Jiahe Cheng
- Applicant: HKC Corporation Limited , Chongqing HKC Optoelectronics Technology Co.,ltd.
- Applicant Address: CN Shenzhen CN Chongqing
- Assignee: HKC CORPORATION LIMITED,CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: HKC CORPORATION LIMITED,CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen CN Chongqing
- Agency: WPAT, PC
- Priority: CN201710386685 20170526
- International Application: PCT/CN2017/091884 WO 20170705
- International Announcement: WO2018/214245 WO 20181129
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/11 ; H05K1/18 ; H05K5/00 ; H05K1/02

Abstract:
The present application discloses a heat dissipation structure and a display device, the heat dissipation structure includes a backplate, a circuit board, and a thermal pad; the circuit board includes a first contact area and a second contact area, and the second contact area is in contact with the backplate; a first end of the thermal pad is affixed to a chip of a flexible circuit board of the display device, and a second end of the thermal pad is affixed to the first contact area so as to conduct heat of the chip to the circuit board and the backplate.
Public/Granted literature
- US20190223332A1 HEAT DISSIPATION STRUCTURE AND DISPLAY DEVICE Public/Granted day:2019-07-18
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