Invention Grant
- Patent Title: Signed division in memory
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Application No.: US16055658Application Date: 2018-08-06
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Publication No.: US10540144B2Publication Date: 2020-01-21
- Inventor: Sanjay Tiwari
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G06F7/535
- IPC: G06F7/535 ; G11C7/00 ; G11C7/06 ; G11C7/10 ; G11C11/4091 ; G06F5/01 ; G11C11/4076

Abstract:
Examples of the present disclosure provide apparatuses and methods for performing signed division operations. An apparatus can include a first group of memory cells coupled to a sense line and to a number of first access lines. The apparatus can include a second group of memory cells coupled to the sense line and to a number of second access lines. The apparatus can include a controller configured to operate sensing circuitry to divide a signed dividend element stored in the first group of memory cells by a signed divisor element stored in the second group of memory cells by performing a number of operations.
Public/Granted literature
- US20190042196A1 SIGNED DIVISION IN MEMORY Public/Granted day:2019-02-07
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