Invention Grant
- Patent Title: Connection structure of superconducting wires
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Application No.: US15940358Application Date: 2018-03-29
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Publication No.: US10541068B2Publication Date: 2020-01-21
- Inventor: Akinobu Nakai , Toshiaki Amano , Hisaki Sakamoto
- Applicant: Furukawa Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Furukawa Electric Co., Ltd.
- Current Assignee: Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Dorsey & Whitney LLP
- Priority: JP2015-195751 20151001
- Main IPC: H01B12/06
- IPC: H01B12/06 ; H01F6/06 ; H01R4/68 ; H01L39/02

Abstract:
A connection structure of superconducting wires includes a plurality of superconducting wires are overlapped and connected with each other, each of the plurality of superconducting wires including a substrate and a superconducting layer that are laminated. A non-superconductor is provided at a part of a surface of the superconducting layer of at least one of the superconducting wires and protrudes from the surface.
Public/Granted literature
- US20180218809A1 CONNECTION STRUCTURE OF SUPERCONDUCTING WIRES Public/Granted day:2018-08-02
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