Invention Grant
- Patent Title: Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof
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Application No.: US15668553Application Date: 2017-08-03
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Publication No.: US10541209B2Publication Date: 2020-01-21
- Inventor: Christopher James Kapusta , Raymond Albert Fillion , Risto Ilkka Sakari Tuominen , Kaustubh Ravindra Nagarkar
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Ziolkowski Patent Solutions Group, SC
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L21/52 ; H01L23/28 ; H01L23/552
Abstract:
An electronics package includes a support substrate, an electrical component having a first surface coupled to a first surface of the support substrate, and an insulating structure coupled to the first surface of the support substrate and sidewalls of the electrical component. The insulating structure has a sloped outer surface. A conductive layer encapsulates the electrical component and the sloped outer surface of the insulating structure. A first wiring layer is formed on a second surface of the support substrate. The first wiring layer is coupled to the conductive layer through at least one via in the support substrate.
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