Invention Grant
- Patent Title: Additive manufacturing for an overhang
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Application No.: US15306480Application Date: 2014-09-02
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Publication No.: US10543672B2Publication Date: 2020-01-28
- Inventor: Hou T. Ng , Alejandro Manuel De Pena
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2014/053715 WO 20140902
- International Announcement: WO2016/036348 WO 20160310
- Main IPC: B33Y10/00
- IPC: B33Y10/00 ; B33Y30/00 ; B33Y50/02

Abstract:
In one example, a non-transitory processor readable medium with instructions thereon that when executed cause an additive manufacturing machine to inhibit build material from coalescing in an area of a first layer of build material where a second slice of an object will overhang a first slice of the object formed in the first layer of build material.
Public/Granted literature
- US20170043535A1 ADDITIVE MANUFACTURING FOR AN OVERHANG Public/Granted day:2017-02-16
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