Invention Grant
- Patent Title: Pressurized closure assembly
-
Application No.: US16163696Application Date: 2018-10-18
-
Publication No.: US10543966B2Publication Date: 2020-01-28
- Inventor: William L. Schmidt
- Applicant: Sypris Technologies, Inc.
- Applicant Address: US KY Louisville
- Assignee: Sypris Technologies, Inc.
- Current Assignee: Sypris Technologies, Inc.
- Current Assignee Address: US KY Louisville
- Agency: Middleton Reutlinger
- Main IPC: B65D45/00
- IPC: B65D45/00 ; B65D51/16
Abstract:
A pressurized closure assembly is provided which has a connector assembly to allow improved application of torque in limited space conditions to rotate a head away from the hub of the closure assembly.
Public/Granted literature
- US20190047757A1 Pressurized Closure Assembly Public/Granted day:2019-02-14
Information query
