发明授权
- 专利标题： Thermally conductive polymer composition and thermally conductive molded object
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申请号： US15307763申请日： 2014-12-16
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公开(公告)号： US10544341B2公开(公告)日： 2020-01-28
- 发明人: Kenichi Fujikawa , Yoshiharu Hatakeyama , Miho Yamaguchi , Yuji Yamagishi , Akihiro Oohashi
- 申请人： NITTO DENKO CORPORATION , NITTO SHINKO CORPORATION
- 申请人地址： JP Osaka JP Fukui
- 专利权人： NITTO DENKO CORPORATION,NITTO SHINKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION,NITTO SHINKO CORPORATION
- 当前专利权人地址： JP Osaka JP Fukui
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2014-093649 20140430
- 国际申请： PCT/JP2014/083294 WO 20141216
- 国际公布： WO2015/166609 WO 20151105
- 主分类号： C09K5/14
- IPC分类号： C09K5/14 ; C08K3/38 ; C08K3/04 ; C08K3/22 ; C08K3/28 ; C08K3/36 ; C08J3/20 ; C08J5/18 ; C08L63/00
摘要：
The present invention provides a thermal conductive polymer composition with low probability for mixing of an air bubble in a thermal conductive molded article, which is a thermal conductive polymer composition including thermal conductive inorganic particles having a specific particle size distribution and an electrically insulating polymer.
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